Precision Surfacing Solutions
Precision Surfacing Solutions

DW 288 S4

SMART SLICING TECHNOLOGY FOR SAPPHIRE, AND OTHER HARD AND BRITTLE MATERIALS

Based on widely adopted and successful DW 288 product family

Thanks to the sophisticated work piece rocking the diamond wire saw DW 288 S4 reaches maximum precision in slicing semiconductor silicon and sapphire into wafer. Our de­tailed tech­nol­ogy and process know-how can also be trans­ferred to ce­ram­ics, quartz or other hard and brittle materials.

Your benefits:

  • Rigid and temperature optimized design ensures high yield
  • Best in class for 8 inch semiconductor and sapphire industry
  • Versatile applications for different formats

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